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No matter which ROG X570 motherboard you choose, we want to ensure you can take advantage of the powerful AMD 3rd Gen Ryzen processors, check below to find out how and test yourself with the ROG Crossword Challenge.

• POWER DESIGN

  

  Robust power delivery starts at the component level. Every aspect of the ROG X570 motherboards’ VRM is generously over-specified for the task.

  Learn more about Teamed Power Stages architecture design.

  1. 8-Pin ProCool II Power Connectors

     ProCool II connectors ensure a snug and reliable connection to the EPS 12V power lines.

  2. MOSFETs

     The Crosshair VIII Series VRM is comprised of up to 16 teamed power stages, each rated to handle up to 70 amps.

  3. MicroFine Alloy Chokes

     The MOSFETs is accompanied by a high-permeability alloy-core choke rated to handle 45 amps.

  4. 10K Japanese-Made Black Metallic Capacitors

     Input and output filtering is provided by solid-polymer capacitors rated to last thousands of hours at high operating temperatures.

• OPTIMEM III

  

  Stack the Crosshair VIII Series with your favorite modules and maximize Matisse throughput for applications that demand massive bandwidth, or balance infinity fabric and memory performance for a diverse range of workloads.

  Please note result may vary depending on CPU characteristic Test Configuration: 3rd Gen AMD Ryzen™ ES sample | G.SKILL F4-3600C15D-16GTZR | ROG Crosshair VIII Hero (Wi-Fi)

1. MOS Heatsink with 8mm Heatpipe

   A MOS heatsink provides a large contact area for the MOSFETs and chokes, and a heatpipe enables more efficient cooling of the west and north MOS heatsink for better performance and wattage resistance.

2. Thermal Pad

   A high-quality thermal pad helps transfer heat from the inductor and phase array to the heatsink.

3. Dual M.2 Heatsinks

   The M.2 heatsink keeps the M.2 SSD at the optimum operating temperature for consistent performance and reliability.

4. Active Chipset Heatsink Solution

   PCIe 4.0 provides twice the bandwidth for data flowing through the chipset, which creates more heat than the previous generation. The ROG X570 motherboards feature an actively cooled heatsink to prevent throttling during sustained transfers.

• DUAL PCIE 4.0 M.2

  

  Dual PCIe 4.0 M.2 Slot support up to 22110 and provide NVMe SSD RAID support for an incredible performance boost. Create a RAID configuration with up to two PCIe 4.0 storage devices to enjoy the fastest data-transfer speeds on the 3rd Generation AMD Ryzen platform.

  *The actual transmission speed will be lower than the thoretical maximum speed.

• NETWORKING

  

  ROG X570 motherboards amp up networking with 5G Ethernet*, 2.5G Ethernet* and next-gen Intel® Wi-Fi 6* (802.11ax) that surpasses gigabit speeds to take your LAN to the next level. With ROG GameFirst software that let you build an ROG networking ecosystem with an ROG router, select the best Wi-Fi channel for maximum stability and minimum interference, optimize network traffic and your connection for lag-free online gaming, you’ll enjoy the very best online gaming experience​.
  *On selected model

DIY FRIENDLY

• FLEXKEY

  

  At its default, the FlexKey functions as a system reset button, but it can also be easily set to quickly turn Aura lighting on or off, activate Safe Boot or enter the Bioses.​
  *Only on selected model

• Bioses FLASHBACK™

  

  Simply drop the (UEFI) Bioses file onto a FAT32 formatted USB stick, plug it into the USB Bioses Flashback port and press the button. Updates can even be performed without having memory or a CPU installed.

• ROG PATENTED
  PRE-MOUNTED I/O SHIELD

  

  ROG's patented I/O shield is finished in sleek matte black, and it’s pre-mounted to make it easy to install the motherboard.

• ASUS NODE CONNECTOR

  

  ASUS Node is a proprietary bi-directional interface that allow ASUS motherboards to communicate with other system components, opening up a wealth of new options for system builders.​

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